Toshiba to Showcase Latest Memory and Storage Products at Flash Memory Summit

August 12, 2015

TOKYO— Toshiba Corporation (TOKYO: 6502) today announced that it will showcase its latest flash memory and storage products at the Flash Memory Summit, the world’s largest flash memory conference, which will be held from August 11 to 13 at the Santa Clara Convention Center in Santa Clara, California, USA. The exhibition part of the Flash Memory Summit will be held in the latter two days, August 12 and 13, and Toshiba will be exhibiting at booth #407.

Main Exhibitions:

  1. Flash memory:
    • Latest flash memory technology and products including 3D stacked cell structure flash memory “BiCS FLASH™”
    • NAND flash memory with TSV technology (Reference exhibit)
  2. Mobile memory:
    • Embedded storage memory solutions: UFS, e・MMC™
  3. SD/microSD memory cards for car infotainment
  4. Wireless memory cards:
    • FlashAir™ wireless LAN SDHC memory card
    • NFC SDHC memory card
    • TransferJet™ SDHC memory card
  5. Enterprise SSD:
    • Enterprise SSD PX04P series for server and storage systems supporting PCIe® NVMe™
    • Enterprise SSD PX04S series for server and storage systems supporting 12Gbit/s SAS
    • Enterprise SSD HK3 series for server and storage systems supporting 6Gbit/s SATA
  6. Client SSD:
    • High-end client SSD XG3 series supporting PCIe NVMe
    • Single package client SSD BG1 series supporting PCIe NVMe

 

Notes

* BiCS FLASH and FlashAir are trademarks of Toshiba Corporation.

* e•MMC is a trademark of the JEDEC Solid State Technology Association.

* TransferJet is a trademark licensed by the TransferJet Consortium.

* PCIe is a registered trademark of PCI-SIG.

* NVMe is a trademark of NVM Express, Inc.

Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.